A-SSCC 2024

A-SSCC 2024

IEEE Asian Solid-State Circuits Conference

November 18 - 21, 2024
International Conference Center Hiroshima, Japan

The IEEE A-SSCC (Asian Solid-State Circuits Conference) is an international forum for presenting the most updated and advanced chips and circuit designs in solid-state and semiconductor fields. The conference is supported by the IEEE Solid-State Circuits Society.

IEEE A-SSCC 2024 will be held in Hiroshima, Japan on November 18-21, 2024

The conference will start with a one-day tutorial session on November 18 and plenary talks is scheduled at the start of the main program, November 19 through 21. The main program includes contributed presentations, panel discussion, Student Design Contest exhibition and FPGA demo sessions.

Important Date

Paper submission due: June 10, 2024, 20:00 (GMT)
Acceptance notification: August 9, 2024
Final paper submission: September 12, 2024

For Technical Program Committee Members
TPC Paper selection meeting: July 26, 2024
*The booking for the A-SSCC TPC hotel block will open in mid-April.

Sponsorship Opportunities

A-SSCC2024 A-SSCC is currently offering sponsorship opportunities.
For more information, please click here.
The application deadline is the end of June, 2024.

A-SSCC2024 Office Contact

A-SSCC 2024 Secretariat:
Semiconductor Portal, Inc.
a-sscc2024@semiconportal.com

Sponsorship